JPH0610716Y2 - 回路基板 - Google Patents
回路基板Info
- Publication number
- JPH0610716Y2 JPH0610716Y2 JP13892088U JP13892088U JPH0610716Y2 JP H0610716 Y2 JPH0610716 Y2 JP H0610716Y2 JP 13892088 U JP13892088 U JP 13892088U JP 13892088 U JP13892088 U JP 13892088U JP H0610716 Y2 JPH0610716 Y2 JP H0610716Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thermal expansion
- circuit board
- mounting seat
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 description 19
- 239000004593 Epoxy Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 229910010293 ceramic material Inorganic materials 0.000 description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000008602 contraction Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13892088U JPH0610716Y2 (ja) | 1988-10-25 | 1988-10-25 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13892088U JPH0610716Y2 (ja) | 1988-10-25 | 1988-10-25 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260274U JPH0260274U (en]) | 1990-05-02 |
| JPH0610716Y2 true JPH0610716Y2 (ja) | 1994-03-16 |
Family
ID=31401700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13892088U Expired - Lifetime JPH0610716Y2 (ja) | 1988-10-25 | 1988-10-25 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610716Y2 (en]) |
-
1988
- 1988-10-25 JP JP13892088U patent/JPH0610716Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0260274U (en]) | 1990-05-02 |
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